The nano coating performed by Chemograf is an advanced and unique process that allows the efficient and fault-free placement of miniature components at the nano level on electronic circuits.
This process extends the operational range of component placement, reducing the spacing between components. Additionally, the nano coating ensures a smooth and efficient flow of solder paste through micron-sized apertures on the stencil.
Another challenge addressed by the nano coating is the effective application of very small components alongside larger ones without errors or inefficiencies.

These are the key advantages of implementing the nano coating process:

• Significant improvement in the solder paste flow efficiency through the stencil apertures, regardless of aperture size.
• Stability and consistency in solder paste application.
• Remarkable enhancement in the uniformity of the applied layer on the circuit
• Significant improvement in stencil cleaning efficiency after use
• Substantial improvement in production efficiency, ultimately boosting profitability